• 专利附录
  • 专利说明
  • 权利要求
  • 类似技术
  • 同族专利
  • 引用文献
  • 法律状态
  • 优先权
    • 专利摘要:
    A heat sink system assembled within a computer enclosure for dissipating heat away from a heat generating element includes a fan duct, a heat pipe and a fan. The computer enclosure forms an opening. The fan duct is a square hollow shell attached to the computer enclosure, with a surface thereof coupled to the computer enclosure. A first hole is defined in the surface of the fan duct in communication with the opening, thereby communicating with an exterior of the computer enclosure. A second hole is defined in another surface of the fan duct in communication with an interior of the computer enclosure. The heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and the fan duct. The main body has a conductive material disposed therein. The fan is assembled within the first hole.
    公开号:US20010005310A1
    申请号:US09/769,653
    申请日:2001-01-25
    公开日:2001-06-28
    发明作者:Hsien-Shen Pei；Chung-Yung Sun；Chao-Yang Lee
    申请人:FOXONN PRECISION COMPONENTS Co Ltd；
    IPC主号:G06F1-20
    专利说明:
    [0001] This is a Divisional Application of U.S. application Ser. No. 09/364,322, filed on Jul. 29, 1999, which is now pending. [0001] BACKGROUND OF THE INVENTION
    [0002] 1. Field of the Invention [0002]
    [0003] The present invention relates to a heat sink system, and particularly to a heat sink system having a fan. [0003]
    [0004] 2. Description of Prior Art [0004]
    [0005] As computer technology continues to advance, central processing units and chipsets in computers have faster operational speeds and larger functional capabilities. Heat produced within a computer enclosure increases greatly due to the increase in the operational speed. It is desirable to dissipate the heat quickly, for example using a heat sink system assembled within the computer enclosure, so that the computer chips operate in their normal temperature range. This will assure the quality of data operation, storage and transfer. [0005]
    [0006] A conventional heat sink system includes a heat sink and a fan mounted on the chip. The heat produced by the chip is first transferred to the heat sink attached to the chip, and is then dissipated by the fan mounted on the heat sink. As chips get faster and produce more heat, the size of the heat sink must be correspondingly increased. However, increasing the size of the heat sink is not in line with the trend toward miniaturization in the computer industry. Furthermore, the surface area of a heat sink is limited by practical consideration in manufacturing technology. [0006] SUMMARY OF THE INVENTION
    [0007] Accordingly, an object of the present invention is to provide a heat sink system for dissipating heat away from a heat generating element. [0007]
    [0008] In a preferred embodiment of the present invention, a heat sink system, assembled within a computer enclosure for introducing ambient air though an opening of the computer enclosure to dissipate heat away from a heat generating element, comprises a fan duct, a heat pipe and a fan. The fan duct has a surface coupled to the computer enclosure near the opening. The fan duct defines a first hole in communication with the opening and a second hole substantially within an interior of the computer enclosure. The heat pipe is attached and connected between the heat generating element and the fan duct. The fan is assembled within the first hole of the fan duct. [0008] BRIEF DESCRIPTION OF THE DRAWINGS
    [0009] Other objects and advantages of the present invention will be understood from the following description of a heat sink system according to preferred embodiments of the present invention shown in the accompanying drawings, in which: [0009]
    [0010] FIG. 1 is a perspective view of a heat sink system embodying the concepts of the present invention in accordance with a first embodiment; [0010]
    [0011] FIG. 2 is a perspective view of a second embodiment of a heat sink system in accordance with the present invention; and [0011]
    [0012] FIG. 3 is a perspective view of a third embodiment of a heat sink system in accordance with the present invention. [0012] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS
    [0013] For facilitating understanding, like components are designated by like reference numerals throughout the various embodiments shown in the attached drawing figures. [0013]
    [0014] FIG. 1 shows a heat sink system of the present invention comprising a heat pipe [0014] 10, a fan duct 20 and a fan 30. The fan duct 20 is a square hollow metallic shell attached to a computer enclosure 40 forming an opening (not shown). A surface of the fan duct 20 coupled to the computer enclosure 40 defines a first hole (not shown) in communication with the opening of the computer enclosure thereby communicating with an exterior of the computer enclosure 40. A second hole 22 is defined in a surface opposite the first hole and in communication with an interior of the computer enclosure 40. The fan 30 is assembled within the first hole for aspirating cold air from the exterior into the fan duct 20. The heat pipe 10 includes a main body 12 and two attaching portions 14 at opposite ends of the main body 12. The two attaching portions 14 are attached to a heat generating element 60 (such as a chip) and the fan duct 20, respectively. Working fluid in a liquid state at a nonoperating temperature, such as water, is filled within the main body 12.
    [0015] Thus, heat can be conducted away from the heat generating element [0015] 60 toward the fan duct 20 due to convection of the liquid and due to the liquid changing to a gaseous state. Cold air is aspirated from the exterior through the first hole and the fan duct 20 and out of the second hole 22 whereby heat accumulating in the fan duct 20 is dissipated. Since the heat pipe 10 has a high conductibility, since the fan duct 20 has a large surface area and since the fan 30 aspirates cold air for enhancing convection, the heat sink system of the present invention provides beneficial heat dissipation qualities.
    [0016] Referring to FIG. 2, the heat sink system of a second embodiment of the present invention includes a heat pipe [0016] 10, a fan duct 20, a fan 30 and a computer enclosure 40. The fan duct 20 is a square hollow plastic shell having a side surface attached to the computer enclosure 40 having an opening (not shown). The side surface of the fan duct 20 defines a first hole 24 in communication with the opening of the computer enclosure 40 thereby communicating with an exterior of the computer enclosure 40. A second hole 22 is defined in a top surface of the fan duct 20 and in communication with an interior of the computer enclosure 40. The fan 30 is attached to the top surface of the fan duct 20 and engages with the second hole 22 for aspirating cold air from the exterior through the fan duct 20 to the interior. The heat pipe 10 includes a main body 12 and two attaching portions 14 at both ends of the main body 12. The two attaching portions 14 are attached to a heat generating element 60 (such as a chipset) and the computer enclosure 40 at a position proximate the fan 30, respectively. Working fluid in a liquid state at a nonoperating temperature, such as water, is filled within the main body 12.
    [0017] Thus, heat can be conducted away from the heat generating element [0017] 60 toward the computer enclosure 40 due to convection of the liquid and the liquid changing to a gaseous state. The cold air is aspirated from the first hole 24 through the fan duct 20 and out of the second hole 22. The cold air then exits the fan 30 and directly strikes the computer enclosure 40 whereby heat accumulating on the computer enclosure 40 is dissipated. Furthermore, the computer enclosure 40 having a large surface area promotes dissipation of heat to the exterior.
    [0018] Referring to FIG. 3, the heat sink system of a third embodiment of the present invention includes a heat pipe [0018] 10, a fan duct 20, a fan 30, a computer enclosure 40 and a folded fin 50. The fan duct 20 is a square hollow plastic shell having a side surface attached to the computer enclosure 40 forming an opening (not shown). The side surface of the fan duct 20 defines a first hole 24 in communication with the opening of the computer enclosure 40 thereby communicating with an exterior of the computer enclosure 40. A second hole 22 is defined in a top surface and in communication with an interior of the computer enclosure 40. The fan 30 is assembled in the second hole 22 for aspirating cold air from the exterior through the fan duct 20 and into the interior. The folded fin 50 bent from a metallic plate in the shape of a waveform is attached to the computer enclosure 40 facing the fan 30. The heat pipe 10 includes a main body 12 and two attaching portions 14 at opposite ends of the main body 12. The two attaching portions 14 are attached to a heat generating element 60 (such as a chip) and the folded fin 50, respectively. Working fluid in a liquid state at a nonoperating temperature, such as water, is filled within the main body 12.
    [0019] Thus, heat can be conducted from a heat generating element [0019] 60 toward the folded fin 50 and the computer enclosure 40 due to convection of the liquid and the liquid changing to a gaseous state. Cold air is aspirated from the first hole 24 through the fan duct 20 and toward the computer enclosure 40 whereby heat accumulated on the folded fin 50 having a large surface area and the computer enclosure 40 is dissipated. Furthermore, the computer enclosure 40 having a large surface area promotes quick dissipation of the heat to the exterior.
    [0020] It is understood that the invention may be embodied in other specific forms without departing from the spirit of the central characteristics thereof. Thus, the present examples and embodiments are to be considered in all respects as illustrative and not restrictive, and the invention is not to be limited to the details given herein. [0020]
    权利要求:
    Claims (8)
    [1" id="US-20010005310-A1-CLM-00001] 1. A heat sink system assembled within a computer enclosure for introducing ambient air though an opening of the computer enclosure to dissipate heat away from a heat generating element, comprising:
    a fan duct coupled to the computer enclosure the opening, the fan duct having a first hole in communication with the opening and a second hole situated within an interior of the computer enclosure;
    a folded fin attached to the computer enclosure;
    a heat pipe attached and connected between the heat generating element and the folded fin and having one end portion opposing the second hole of the fan duct; and
    a fan being attached to the fan duct and overlaying the second hole of the fan duct to guide ambient air inflowing from the first hole through the second hole to directly cool the end portion of the heat pipe.
    [2" id="US-20010005310-A1-CLM-00002] 2. The heat sink system as described in
    claim 1 , wherein the fan duct is a square hollow shell.
    [3" id="US-20010005310-A1-CLM-00003] 3. The heat sink system as described in
    claim 1 , wherein the second hole is aligned with the first hole.
    [4" id="US-20010005310-A1-CLM-00004] 4. The heat sink system as described in
    claim 1 , wherein the heat pipe includes a main body and two attaching portions at opposite ends thereof for being respectively attached to the heat generating element and a portion of the computer enclosure facing the second hole.
    [5" id="US-20010005310-A1-CLM-00005] 5. The heat sink system as described in
    claim 4 , wherein conductive material is received in the main body of the heat pipe and is in a liquid state at a nonoperating temperature.
    [6" id="US-20010005310-A1-CLM-00006] 6. The heat sink system as described in
    claim 1 , wherein the folded fin faces the second hole of the fan duct.
    [7" id="US-20010005310-A1-CLM-00007] 7. A heat sink system assembled within a computer enclosure for introducing ambient air to dissipate heat away from a heat generating element, comprising:
    a fan duct coupled to the computer enclosure and defining a first hole in communication with an exterior outside the computer enclosure, and a second hole in communication with an interior of the computer enclosure;
    a heat sink attached to an inner surface of the computer enclosure; and
    a heat pipe and a fan assembled in the enclosure with structural arrangement that the fan is positioned around the second hole and the heat pipe is connected between the heat generating element and the heat sink wherein the fan is directed to the heat sink.
    [8" id="US-20010005310-A1-CLM-00008] 8. The system as described in
    claim 7 , wherein said fan is specifically directed to a connection portion of the heat sink and the heat pipe.
    类似技术:
    公开号 | 公开日 | 专利标题
    US6988536B2|2006-01-24|Tubular heat dissipation device
    US6796373B1|2004-09-28|Heat sink module
    US7369412B2|2008-05-06|Heat dissipation device
    US7870889B2|2011-01-18|Heat dissipation device with a heat pipe
    US6373700B1|2002-04-16|Heat sink modular structure inside an electronic product
    US7269014B1|2007-09-11|Heat dissipation device
    JP3680018B2|2005-08-10|Multiple heat dissipation module
    US20060032616A1|2006-02-16|Compound heat-dissipating device
    US7423877B2|2008-09-09|Heat dissipation device
    US20040165350A1|2004-08-26|Heat sink assembly with heat pipe
    US7640968B2|2010-01-05|Heat dissipation device with a heat pipe
    US20040114328A1|2004-06-17|Heat dissipation device for electronic component
    US20060203451A1|2006-09-14|Heat dissipation apparatus with second degree curve shape heat pipe
    US7487825B2|2009-02-10|Heat dissipation device
    US7269012B2|2007-09-11|Heat dissipation device for heat-generating electronic component
    US20080192428A1|2008-08-14|Thermal management system for computers
    US6320746B2|2001-11-20|Heat sink system
    US20070215319A1|2007-09-20|Heat dissipation device having a bracket
    US20040179335A1|2004-09-16|Double-winged radiator for central processing unit
    US6333850B1|2001-12-25|Heat sink system
    US6542370B1|2003-04-01|Heat dissipating device for a CPU
    JP2001118984A|2001-04-27|Electronic module and electronic module with connector
    US20080121370A1|2008-05-29|Heat dissipation device with a heat pipe
    US20070146995A1|2007-06-28|Heat dissipation device
    US20070095509A1|2007-05-03|Heat dissipation having a heat pipe
    同族专利:
    公开号 | 公开日
    US6320746B2|2001-11-20|
    引用文献:
    公开号 | 申请日 | 公开日 | 申请人 | 专利标题
    CN107097035A|2016-02-18|2017-08-29|通用电气公司|The system and method for thering is coated component to restore for making gas-turbine unit|JP4290232B2|1997-02-24|2009-07-01|富士通株式会社|Heat sink and information processing device using it|
    US6117748A|1998-04-15|2000-09-12|Worldwide Semiconductor Manufacturing Corporation|Dishing free process for shallow trench isolation|US6394175B1|2000-01-13|2002-05-28|Lucent Technologies Inc.|Top mounted cooling device using heat pipes|
    EP1623309A2|2003-05-13|2006-02-08|Zalman Tech Co., Ltd.|Computer|
    KR100624092B1|2004-09-16|2006-09-18|잘만테크 주식회사|Computer|
    FR2876812B1|2004-10-15|2006-12-22|J C C Chereau Aeronautique|COOLING FLUID DEVICE FOR COMPUTER|
    CN100426494C|2005-06-24|2008-10-15|鸿富锦精密工业（深圳）有限公司|Heat radiator of heat pipe|
    DE102008011291A1|2008-02-27|2009-09-03|Marquardt Gmbh|Electrical device i.e. electric power tool, has conducting elements with one end opposite to generating component in housing interior, and other end opposite to housing exterior such that heat is dissipated from interior to exterior|
    EP3281080B1|2015-04-10|2019-02-27|Phoenix Contact Development and Manufacturing, Inc.|Enclosure with multiple heat dissipating surfaces|
    法律状态:
    2001-01-25| AS| Assignment|Owner name: FOXONN PRECISION COMPONENTS CO., LTD, TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:PEI, HSIEN-SHEN;SUN, CHUNG-YUNG;LEE, CHAO-YANG;REEL/FRAME:011473/0547;SIGNING DATES FROM 20001218 TO 20001222 |
    2001-11-01| STCF| Information on status: patent grant|Free format text: PATENTED CASE |
    2005-05-17| FPAY| Fee payment|Year of fee payment: 4 |
    2009-05-11| FPAY| Fee payment|Year of fee payment: 8 |
    2013-03-13| FPAY| Fee payment|Year of fee payment: 12 |
    优先权:
    申请号 | 申请日 | 专利标题
    US09/364,322|US6333850B1|1999-02-05|1999-07-29|Heat sink system|
    US09/769,653|US6320746B2|1999-07-29|2001-01-25|Heat sink system|US09/769,653| US6320746B2|1999-07-29|2001-01-25|Heat sink system|
    [返回顶部]